Writing a real test plan, bench validation versus production test, automated test equipment, JTAG boundary scan, functional versus structural test, and the environmental and accelerated-stress techniques (HALT/HASS) that surface failures before customers do.
A pass/fail result is only as good as the test plan behind it. This module builds a real test plan from the ground up — what to test, how pass/fail criteria trace back to actual requirements, and how functional and fault coverage answer two genuinely different questions about the same chip. From there it separates bench validation (does the design work) from production test (was this specific unit built correctly), and walks through the automated test equipment, JTAG boundary scan, and scan/ATPG structural test techniques a real production line depends on.
By the end of this module you should be able to explain why HALT and HASS are two different tools solving two different problems, and why a temperature-cycling profile has to be grounded in a real package's thermal behavior rather than picked arbitrarily. This module also connects Module 6's ASIC signoff and Module 12's package thermal characteristics as direct test-plan inputs, and hands failing results forward to Module 15, Hardware Debugging.