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Applied Semiconductor & Electronics Engineering Professional Program

Learn to design, verify, and bring up real semiconductor and electronics hardware — from device physics and analog/digital fundamentals through FPGA and ASIC design, PCB and high-speed design, power electronics, manufacturing, and test.

25 modules in 6 phases, with worked examples, interactive tools, labs and a quiz in every one, and a certificate of completion.

25 Modules6 PhasesInteractive lessons5 Real Projects12-Template KitQuizzesCertificate
Level
Foundations to applied practice
Before you start
Basic circuits and algebra
Study plan
About 70 hours, self-pacedProgram planning estimate, including practice and projects. Your pace may vary.
Try a free lessonExplore the curriculum

What you’ll build

Build a power budget and document a circuit decision.

EXCERPT FROM AN ACTUAL CURRICULUM PROJECT

Analog Sensor Signal Conditioning Board

Preview the worked example and project output

Excitation Current Source Sizing — Worked Calculation

Driving current through the RTD is what turns its resistance into a voltage — but that same current also dissipates power in the sensor itself, which self-heats it above the actual process temperature and introduces a direct measurement error. A typical thin-film PT100 element in still air has a dissipation constant of roughly 5 mW/°C (manufacturer datasheets show a range of about 2-8 mW/°C depending on package and…

Precision constant-current source IC (or precision reference + matched transistor pair), 1 mA output
1
Sized to hold RTD self-heating to ≈0.032°C worst case against a ~5 mW/°C dissipation constant
Precision voltage reference, 2.5V, low drift
1
Feeds the current source and the ADC reference so excitation and conversion track together
PT100 4-wire RTD sensor, 100Ω @ 0°C, α = 0.00385
1
4-wire Kelvin connection removes lead-wire resistance error (Module 9)

Selected training excerpt, not a complete design or a project submission. The full project includes its assumptions, methods and checks.

Explore this project →

Build your own phase-by-phase workbook, record the evidence behind your decisions and download your work.

Try a 5-minute lesson · free

Build an energy budget

  1. Read the problem and identify the units.
  2. Change the inputs and estimate the result.
  3. Check your answer and explain one assumption.

Estimate the daily energy needed by an equipment load. Change the power and operating hours, then check your estimate.

Inputs: 12 and 8Wh/dayEstimate first, then check the result below.

Daily energy = power × operating hours

Constant electrical input power; startup, standby and changing operating loads are excluded. This free exercise does not mark a paid module complete.

Related full-program tool: N Type P Type Doping lab →

Your learning path

Choose a phase to explore its lessons and project work.

Start with the free lesson →
Phase 1: Foundations (3 lessons)

Covers Semiconductor Physics, Analog Electronics and Digital Electronics.

  1. Semiconductor Physics

    Band theory, intrinsic vs. extrinsic semiconductors, doping, charge carriers, the PN junction, and drift vs. diffusion current.

  2. Analog Electronics

    Diodes, BJT/MOSFET biasing, op-amp topologies, negative feedback, active filters, and real-world analog design limits.

  3. Digital Electronics

    Boolean algebra, combinational and sequential logic, finite state machines, CMOS electrical characteristics, and basic timing.

Project checkpoint: Record the assumptions, calculations and evidence behind this phase’s outcome in your project workbook.

Phase 2: Digital Design & Programmable Logic (3 lessons)

Covers FPGA, Verilog & VHDL and ASIC Design Flow.

  1. FPGA

    FPGA architecture (LUTs, CLBs, routing fabric), FPGA vs. ASIC trade-offs, the implementation flow, and clock resources.

  2. Verilog & VHDL

    HDL fundamentals, modeling styles, blocking vs. non-blocking assignment, testbenches, and synthesizable design.

  3. ASIC Design Flow

    The full RTL-to-GDSII flow, timing closure, physical verification signoff, tape-out, and custom-silicon economics.

Project checkpoint: Record the assumptions, calculations and evidence behind this phase’s outcome in your project workbook.

Phase 3: Hardware Design (6 lessons)

Covers PCB Design, Embedded Systems, Signal Integrity, Power Electronics, High-Speed Design and IC Packaging.

  1. PCB Design

    Schematic capture, footprints, layer stackup, routing rules, ground/power plane strategy, and DFM considerations.

  2. Embedded Systems

    MCU vs. MPU vs. SoC, memory architecture, core peripherals, interrupt handling, and firmware architecture.

  3. Signal Integrity

    Transmission lines, reflections, crosstalk, ground bounce, power integrity/decoupling, and eye diagrams.

  4. Power Electronics

    Linear vs. switching regulators, efficiency and thermal design, power sequencing, and battery management basics.

  5. High-Speed Design

    LVDS/DDR/PCIe signaling, differential pair routing, length matching, via stubs, and SI/PI simulation.

  6. IC Packaging

    Package types (DIP to WLCSP), package parasitics, thermal resistance, and wire-bond vs. flip-chip die attach.

Project checkpoint: Record the assumptions, calculations and evidence behind this phase’s outcome in your project workbook.

Phase 4: Manufacturing & Verification (5 lessons)

Covers Semiconductor Manufacturing, Testing & Validation, Hardware Debugging, Design Verification and Troubleshooting.

  1. Semiconductor Manufacturing

    Wafer fabrication, photolithography, doping and deposition/etch, process nodes, and yield economics.

  2. Testing & Validation

    Test plan development, bench vs. production test, ATE basics, boundary scan/JTAG, and reliability testing.

  3. Hardware Debugging

    Oscilloscope and logic-analyzer technique, systematic debug methodology, and common failure signatures.

  4. Design Verification

    Verification vs. validation, testbench methodology, functional coverage, assertions, and formal verification.

  5. Troubleshooting

    Real diagnostic scenarios — field-only timing faults, power/signal coupling, FPGA sim-vs-hardware bugs, and bus lockups.

Project checkpoint: Record the assumptions, calculations and evidence behind this phase’s outcome in your project workbook.

Phase 5: Real Projects (5 lessons)

You apply what you have learned to 5 complete designs, starting with Analog Sensor Signal Conditioning Board.

  1. Analog Sensor Signal Conditioning Board

    A 4-wire RTD instrumentation-amplifier front end — worked gain, filter, and self-heating calculations.

  2. FPGA-Based Digital Signal Processing Board

    A pipelined FIR filter in Verilog — fixed-point quantization, resource estimate, and a worked timing budget.

  3. High-Speed DDR3 Memory Interface Board

    Stackup, length matching, fly-by termination, and a worked skew-budget calculation for a DDR3-800 interface.

  4. Embedded IoT Sensor Node

    A coin-cell wireless sensor node — low-power firmware, RF-aware layout, and a worked battery-life calculation.

  5. Multi-Rail Power Management Board

    Buck/LDO topology selection, power sequencing, and a worked efficiency/thermal calculation for an FPGA power tree.

Project checkpoint: Record the assumptions, calculations and evidence behind this phase’s outcome in your project workbook.

Phase 6: Resources & Certification (3 lessons)

Covers Professional Engineering Practice, Documentation & Resource Kit and Capstone: Digital System Design & Certification.

  1. Professional Engineering Practice

    Requirements definition, design reviews, the ECO process, IP licensing, and working with CMs and foundries.

  2. Documentation & Resource Kit

    A downloadable kit of 12 real project templates, from a component selection worksheet to an ECO template.

  3. Capstone: Digital System Design & Certification

    A final data-acquisition-system design assignment, drawing-interpretation and troubleshooting exercises, and your certificate of completion.

Project checkpoint: Record the assumptions, calculations and evidence behind this phase’s outcome in your project workbook.

Open the visual program roadmap
Program
25 modules in 6 phases
›
Phase
a group of modules with one outcome
›
Module
one unit of the program, numbered in order
›
Topic
a part of a module
›
Step
one screen inside a module
▶ START HERE
3
Hardware Design
Covers PCB Design, Embedded Systems, Signal Integrity, Power Electronics, High-Speed Design and IC Packaging.
0/6 done
4
Manufacturing & Verification
Covers Semiconductor Manufacturing, Testing & Validation, Hardware Debugging, Design Verification and Troubleshooting.
0/5 done
5
Real Projects
You apply what you have learned to 5 complete designs, starting with Analog Sensor Signal Conditioning Board.
0/5 done
🎓 Certificate of completion
0%
Your training track
25 modules in 6 phases
Preview the path. Everything is unlocked with your purchase. Each step mixes short lessons, interactive tools, labs and practice.
Start: Semiconductor Physics →
🎓Certificate
Phase 1

Foundations

By the end: Covers Semiconductor Physics, Analog Electronics and Digital Electronics.

Semiconductor PhysicsAnalog ElectronicsDigital Electronics
  1. 🔬
    Semiconductor PhysicsUP NEXT🔒
    Band theory, intrinsic vs. extrinsic semiconductors, doping, charge carriers, the PN junction, and drift vs. diffusion current.
    🔬 N Type P Type Doping lab🔬 PN Junction Formation lab
  2. 🎚️
    Analog Electronics🔒
    Diodes, BJT/MOSFET biasing, op-amp topologies, negative feedback, active filters, and real-world analog design limits.
    📄 Analog VS Digital ICS🔬 Filtering DC Supply lab🔬 Bridge Rectifier lab
  3. 🔢
    Digital Electronics🔒
    Boolean algebra, combinational and sequential logic, finite state machines, CMOS electrical characteristics, and basic timing.
    📄 Analog VS Digital ICS🔬 Bridge Rectifier lab🔬 Diode Operation lab
🧮 Calculator🔬 Lab🎛️ Simulator🖼️ Drawings📐 Designer📄 Article🧩 Planned, not built yet

One project, built phase by phase

Electronics design workbook: Build a power budget and document a circuit decision. Keep a result and a verification note for each phase.

Your All-Access Pass includes the project workbook, lesson notes, self-review checklists and portfolio downloads. Try the free lesson above to see a worked example.

Certificate and completion
SAMPLE · NOT AN ISSUED CERTIFICATE

Certificate of Completion

Your name

Applied Semiconductor & Electronics Engineering Professional Program

EngineersUniverse · self-paced learning

Finish all required module quizzes to unlock your certificate of completion. Modules with a score requirement must meet that requirement. Your project portfolio and skills summary are separate downloads for your own learning record.

A certificate of completion is not a professional license or accreditation.

What's in the downloadable kit?

12 real project templates — a component & datasheet selection worksheet, a schematic & layout design review checklist, a PCB stackup & impedance target worksheet, a power budget & decoupling worksheet, an IC package & land pattern selection worksheet, an ESD & handling procedure checklist, a bring-up & first-power test checklist, a design verification test plan template, a hardware debug log template, a bill of materials template, an engineering change order (ECO) template, and a design review sign-off checklist. Available for download from Module 20 (Documentation & Resource Kit) once you've unlocked the program.